Heater chips with silicon die bonded on silicon substrate, including offset wire bonding

ABSTRACT

A heater chip has a substrate and at least one die, made of silicon, and a bond non-adhesively attaching them. The substrate, thick enough to resist bowing, has ink supply vias from back to front surfaces. The die has ink flow vias from back to front surfaces and circuitry including heater elements adjacent the front surface interspersed with ink flow vias. A metal through the die connects a conductor on a front of the substrate to a heater element on a front of the die. A wire bond connects to the front of the substrate, but is offset from die.

The present application is a continuation of, and claims the benefit ofand priority to, U.S. patent application Ser. No. 12/237,015, filed onSep. 20, 2011, now U.S. Pat. No. 8,459,779, which is acontinuation-in-part of, and claims the benefit of and priority to, U.S.patent application Ser. No. 13/102,091, filed on May 6, 2011, now U.S.Pat. No. 8,087,756, which is a continuation of, and claims the benefitof and priority to, U.S. patent application Ser. No. 12/101,215, filedon Apr. 11, 2008, now U.S. Pat. No. 7,938,513, the entire contents ofeach of which are incorporated by reference herein.

CROSS REFERENCE TO RELATED APPLICATION

This patent application is related to the U.S. patent application Ser.No. 11/848,246, filed Aug. 31, 2007, entitled “Micro-fluid EjectionHeads And Methods For Bonding Substrates To Supports” and assigned tothe assignee of the present application.

BACKGROUND

1. Field of the Invention

The present invention relates generally to fluid ejection modules and,more particularly, to a heater chip for an inkjet printhead chip modulehaving a silicon die bonded on a silicon substrate and methods offabricating the heater chip.

2. Description of the Related Art

A thermal inkjet printhead is used in a variety of products, such asprinters, copiers, faxes and the like, to form and propel drops of inkonto a sheet of print medium, such as paper. In general, an image isproduced by the ink drops being emitted from the printhead at precisemoments such that they impact the print medium at a desired location.The printhead is supported by a movable carriage within the product andis caused to reciprocate relative to the advancing print medium. Itemits the ink drops at times pursuant to commands of a microprocessor orother controller. The timing of the ink drop emissions corresponds to apattern of pixels of the image being printed.

One thermal inkjet printhead of a conventional design used in suchproducts is illustrated diagrammatically (not to scale) in FIG. 1, withan enlarged fragment of the design illustrated diagrammatically in FIG.2. The printhead 10 has a chip module 14 composed of a heater chip 20, anozzle plate 22 attached to or integrated with the heater chip 20, andan input/output connector (not shown), such as a tape automated bond(tab) circuit, for electrically connecting the heater chip 20 to theprinter during use. The heater chip 20 has a single silicon substrate 24seated within and adhesively bonded at 28 to the recessed mouth portion16 of the bottle 18 on the base plate 12 thereof. The heater chip 20also has electrical circuitry which includes a plurality of electricallogic components (not shown) and resistors or heater elements 30, asseen in FIG. 2, built, on the silicon substrate 24. Each heater chip 20of a given printhead chip module 14 is fabricated using conventionalmicroelectronic manufacturing techniques and, more particularly, as partof a multiplicity of heater chips processed on a single silicon waferfollowing conventional semiconductor processing steps. Thus, it will beunderstood that the heater elements 30 are an integral part of the upperportion of the silicon substrate 24, i.e. they are part of theelectrical device, of the heater chip 20, as seen in FIG. 2.

The conventional design, illustrated in FIGS. 1 and 2 and similarlydisclosed in U.S. Pat. No. 6,402,301, which is hereby incorporated byreference in its entirety, is effective for today's print qualitydemands; however, it is apparent that the system described above hasprint quality limitations, invites long-term corrosion issues, and isless than simple to manufacture. The shortcomings of the conventionaldesign insofar as they affect print quality relate primarily to ink dropmisdirection and ink drop size.

Regarding ink drop misdirection, anomalies which cause it are ones thatadversely affect nozzle planarity, bore angle of nozzle sidewalls, inkdrop velocity, heater/nozzle plate alignment, and dimensionalrelationships between components. Nozzle planarity determines thedirection the ink is dispensed (i.e. drop misdirection). If the nozzleplate is warped or bowed, the desired direction of the ink-jetting iscompromised. Nozzle planarity is affected by a mismatch of thecoefficient of thermal expansion (CT) between the base plate of the inkbottle and the silicon substrate of the heater chip, between componentsof the chip module itself, and between the die bond adhesive layer,encapsulant material and the heater chip. Further affecting nozzleplanarity are planarity of the base plate in the bottle, non-uniformdeposition of either the FF material or a photo-imageable nozzle platelayer impacting formation of the nozzle holes, and sagging of the nozzleplate into the via due to lack of support over the via causingmisdirection of nozzle holes.

Bore angle, the angle of the sidewalls of the nozzle holes through thenozzle plate, is ideal when it is reentrant, i.e. a narrow opening atthe surface of the nozzle plate over a wider opening at the base.Current technologies are severely limited in their ability to repeatablyproduce this feature. Repeatable bore angle is fundamental to limitingink jetting misdirection and drop velocity. Ink drop velocity isadversely affected by distortion of the dimensions of the heaterelements and the size of the ink ejection chambers. Heater size islimited by the heater chip surface space.

The heater chip/nozzle plate alignment in the chip module is affected byhow well the nozzle plate is aligned with the heater elements, which isproving to be very difficult to accomplish. Also, expansion andcontraction of the nozzle plate resulting from other wet and dryprocessing will affect this alignment. Anomalies affecting dimensionalrelationships, such as X-spacing, Y-spacing, Z-height, skew and tilt,are the CTE mismatch of the base plate and substrate, the flatness ofthe base plate, the repeatability and precision of tab bond and tabattach, and the CTE mismatches between heater chip/die bond adhesivematerial.

Thus, there is a need for an innovation to overcome the above-mentionedshortcomings of the conventional design of the printhead chip module soas to reduce the deleterious effects of the printhead chip module designon print quality.

SUMMARY OF THE INVENTION

The present invention meets this need by providing an innovation whichallows replacement of the traditional adhesive die bonding of the chipmodule to the base plate of the plastic ink bottle which required curingat a high temperature causing expansion and contraction cycling duringcooling which is a major contributor to poor heater chip and nozzleplate alignment as well as warping and bowing due to mismatch of CTEbetween components which compromises nozzle plate planarity, resultingin misdirection of ink drop jetting from the nozzle holes. Underlyingthe innovation of the present invention is the insight that by devisinga different construction for the heater chip through a different methodfor fabricating the heater Chip, in which, by separately processing acarrier wafer of silicon for making silicon substrates, to serve thefunction of base plates, and a device wafer of silicon for makingsilicon dies, and non-adhesively bonding the carrier and device wafersto one another, and dicing the bonded wafers into the chip modules, theneed to utilize an adhesive die bond attachment of the heater chip ofthe chip module to the plastic base plate of the ink bottle could beeliminated and a suitable non-adhesive mechanical attachment of theheater chip to the ink bottle could be substituted in its place,eliminating the deleterious effects on the heater chip of the adhesiveattachment process in terms of warping and bowing which adversely impactprint quality. Alternatively, by dicing the device wafer into diesbefore the bonding thereof to the carrier wafer, bonding the diced diesto the substrates of the carrier wafer and dicing the carrier wafer intosubstrates laden with plural dies, chip modules are produced havingmultiple dies.

Other advantages which will become apparent hereinafter relating to costreduction of printhead chip module fabrication and tailoring ofprinthead chip module construction for the particular application canalso be gained by the insight underlying the present invention ofseparate processing of carrier and device wafers for respectively makingarrays of substrates and dies for bonding together and dicing into chipmodules. This allows the relative makeup and size of the substrate anddie(s) to be separately tailored for the particular conditions of agiven application for meeting the goal of precise construction andoperation at low cost while still maintaining or improving printquality.

Accordingly, in an aspect of an embodiment of the present invention, aheater chip for a printhead chip module includes three basic components:first, a substrate made of silicon of a carrier wafer, of apredetermined thickness tailored to resist bowing and containing inksupply vias; second, at least one die (and in some embodiments pluraldies) made of silicon of a device wafer separate from the carrier wafer,of a predetermined thickness relative to that of the substrate,containing electrical circuitry including heater elements interspersedwith the ink flow vias and being superimposed on the substrate such thatthe ink flow vias of the die align with the ink supply vias of thesubstrate and such that respective selected surface portions on the dieand substrate align with one another and are disposed adjacent to andfacing one another; and, third, a bond non-adhesively formed between therespective facing surface portions on the substrate and die beinghermetic and attaching the substrate and die together. A metal throughthe die connects a conductor on a front of the substrate to a heaterelement, on a front of the die.

In another aspect of an embodiment of the present invention, the bondbetween the respective facing surface portions on the substrate and dieis formed by low temperature bonding technology wherein a composition isapplied on the respective facing surface portions of at least one of thesubstrate and die enabling the formation of the bond.

In an exemplary embodiment of the present invention, the composition onthe respective facing surface portions of the at least one of thesubstrate and die is a monolayer of an amine functional group adapted toform a covalent bond transforming the substrate and die into asubstantially continuous hermetic structure at the respective facingsurface portions thereon.

In another exemplary embodiment of the present invention, thecomposition on the respective facing surface portions of the at leastone of the substrate and die is a solution of 2% TMAH(tetramethylammonium hydroxide) adapted to form by a low temperaturebonding technique a substantially hermetic polymerized silicon oxidebond between the substrate and die at the respective facing surfacesthereon.

In another aspect of an embodiment of the present invention, a methodfor fabricating a heater chip for use in a printhead chip moduleincludes: processing a first blank wafer composed of silicon into aprocessed carrier wafer containing an array of silicon substrates of apredetermined size tailored to resist bowing; processing a second blankwafer composed of silicon into a processed device wafer containing anarray of silicon dies of a predetermined size relative to that of thesubstrate; preparing respective selected surface portions of at leastone of the processed carrier and device wafers for subsequent bondingtogether; aligning the separately processed carrier and device waferswith one another at the respective facing surface portions; andnon-adhesively and hermetically bonding the aligned carrier and devicewafers to one another at the respective prepared facing surfaceportions. The bonded carrier and device wafers are then diced intoheater chips which each has a single silicon die bonded on each siliconsubstrate. Alternatively, dicing at least with respect to the processeddevice wafer can take place before the preparing, aligning and bondingsteps where the objective is to obtain plural dies to attach to eachsubstrate on the carrier wafer. Then, after the preparing, aligning andbonding steps are performed, resulting in the attachment of the desiredplural dies to individual substrates on the carrier wafers, dicing ofthe individual substrates laden with the plural dies takes place.

Thus, the heater chip and its fabrication methods of the presentinvention provide a solution to the aforementioned problems associatedwith the prior art printhead chip module design in that the necessity ofan adhesive die bond attachment of the heater chip of the chip module tothe ink bottle is obviated by processing the carrier wafer forsubstrates and the device wafer for dies separately and then forming abond between them that is non-adhesive and hermetic in nature and curesat room temperature, which avoids the cycling of expansions andcontractions during cooling as occurs in the case of the prior artadhesive die bonding of the prior art heater chip to the ink bottlewhich is a major contributor to poor chip planarity and reduced printquality. Thus, due to the separate processing of the carrier wafer of anincreased size to resist bowing, the necessity to utilize an adhesivedie bond attachment of the heater chip of the chip module to a plasticbase plate of an ink bottle, if desired, to complete assembly of theprinthead chip module is avoided and substitutable in its place is anon-adhesive attachment of the heater chip to the ink bottle.

Various alternative embodiments, enhancements and other aspects of theheater chip and its fabrication method of the present invention that aredisclosed hereinafter allow the balancing of tradeoffs between chipsize, performance requirements, industry cost reduction trends and otherfactors so as to allow tailoring of heater chip and silicon substrateparameters to achieve a low-cost and precise construction that providesa given ink flow rate into the smaller spaces of one or moreminiaturized heater chips.

DESCRIPTION OF THE DRAWINGS

Having thus described the invention in general terms, reference will nowbe made to the accompanying drawings, which are not drawn to scale, andwherein:

FIG. 1 is a sectional diagram of half of a prior art chip module havinga heater chip constructed in accordance with conventional semiconductorfabrication processes, the missing half being a mirror image of theillustrated half meeting at plane A-A.

FIG. 2 is an enlarged fragmentary sectional diagram of a region of theprior art chip module substantially enclosed by a circle 2 in FIG. 1,

FIG. 3 is a sectional diagram of half of a chip module having a heaterchip of the present invention and constructed in accordance with thefabricating method of the present invention, the missing half being amirror image of the illustrated half meeting at plane B-B.

FIG. 4 is an enlarged fragmentary sectional diagram of a region of thechip module of the present invention as substantially enclosed by acircle 4 in FIG. 3.

FIG. 5 is a flow diagram of an embodiment of the method for fabricatinga heater chip in accordance with the present invention.

FIGS. 6 and 7 are respective fragmentary sectional diagrams ofalternative embodiments of the heater chip of the present invention inrelation to relative substrate and die thicknesses and relative portionsof the ink supply and flow vias through them.

FIGS. 8A-8C are diagrammatic layout views of halves of differentpossible cross-sectional configurations of etched vias, as seen alongline 8-8 of FIG. 4, that can be utilized in the heater chip of thepresent invention, each missing half being a mirror image of theillustrated half meeting at planes C-C, D-D and E-E respectively.

FIG. 9 is a sectional diagram of one embodiment of a heater chip havingmultiple dies bonded on a substrate having an ink flow system manifoldmade up of multiple silicon layers.

FIG. 10 is an enlarged fragmentary sectional diagram of a view takenalong line 10-10 of FIG. 9 showing plural ink supply channels fordifferent ink colors formed between adjacent silicon layers making upthe substrate of a heater chip.

FIG. 11 is a sectional diagram of another embodiment of a heater chipsimilar to that of FIG. 9 providing a page wide printing construction.

FIG. 12 is an enlarged fragmentary sectional diagram of a view takenalong line 12-12 of FIG. 11 showing the same as that with respect toFIG. 10.

FIG. 13A is an enlarged diagram of an exemplary embodiment of half of aheater chip having metal-filled vias for making electrical connectionsbetween the electronic circuitry of the heater chip and the tabcircuitry of the chip module, the missing half being a mirror image ofthe illustrated half meeting at plane F-F and FIG. 13B is an alternateembodiment of FIG. 13A having a wire bond offset from a circuit to ametallization layer of a substrate,

FIG. 14 is a plan view of a multi-component heater chip of the presentinvention having plural dies arranged in a staggered fashion on a singlesubstrate and constructed in accordance with the method of the presentinvention.

DETAILED DESCRIPTION

The present invention now will be described more fully hereinafter withreference to the accompanying drawings, in which some, but not all,embodiments of the invention are shown. Indeed, the invention may beembodied in many different forms and should not be construed as limitedto the embodiments set forth herein; rather, these embodiments areprovided so that this disclosure will satisfy applicable legalrequirements. Like numerals refer to like, comparable or correspondingelements throughout the views.

Also, it should be understood that the invention applies to anymicro-fluid ejection device, not just to thermal inkjet heater chips.While the embodiments of the invention will be described in terms of athermal inkjet printhead, one of ordinary skill will recognize that theinvention can be applied to any micro-fluid ejection system.

Further, it should be understood that many of the embodiments of theinvention employ low temperature bonding technology which is a genericterm that includes within its scope known processes like thermal fusion,chemical surface treatments like those offered by Ziptronix and TMAH,and eutectic gold to silicon bonding. The Ziptronix technique isdisclosed in U.S. Pat. No. 7,109,092 to Tong, assigned to Ziptronix,Inc., the disclosure of which patent is incorporated herein byreference.

Referring now to FIGS. 3 and 4, there is illustrated in a diagrammaticform a Chip module 42 which includes a heater chip 44 having a basicthree-component construction in accordance with one aspect of thepresent invention and also being constructed in accordance with afabrication method constituting another aspect of the present invention.The three-component construction of the heater chip 44 is provided by asubstrate 46 composed of silicon of a carrier wafer, having apredetermined thickness, and located at a back portion of the heaterchip assembly 44, a die 48 composed of silicon of a device waferseparate from the carrier wafer, having a predetermined thicknessrelative to that of the substrate 46, and located at a front portion ofthe heater chip 44, and a bond 50, non-adhesive and hermetic in nature,formed and located between the substrate 46 and die 48 so as to attachthem to one another. Together with the heater chip 44, the chip module42 also includes a nozzle plate 52 attached to or integrated with theheater chip 44, a flow feature (FF) material 54 disposed between thenozzle plate 52 and the die 48, and an input/output connector (notshown), such as a tape automated bond (tab) circuit, for electricallyconnecting the heater chip 44 of the chip module 42 to the printerduring use. The chip module 42 is shown seated within the recessed mouthportion 16 of the bottle 18.

The heater chip 44 also is provided with a plurality of spaced apart inksupply vias 56 penetrating through the substrate 46 between its frontand back surfaces 46 a, 46 b and a plurality of spaced apart ink flowvias 58 penetrating through the die 48 between its front and backsurfaces 48 a, 48 b. The ink flow vias 58 of the die 48 are aligned withthe ink supply vias 56 of the substrate 46 to fluidly connect a supplyof ink from the ink channels 35 of the bottle base plate 12 through theink supply vias 56 of the substrate 46 to a plurality of nozzle holes 60formed through the nozzle plate 52 of the chip module 42.

The heater chip 44 further is provided with electrical circuitryincluding a plurality of electronic logic components (not shown) andresistors or heater elements 62, as seen in FIG. 4, interspersed withthe multiple ink flow vias 58. The flow feature (FF) material 54deposited on the front surface 48 a of the die 48 of the heater chip 44overlies the heater elements 62 and the other electronics componentsbuilt on the die 48, as seen in FIG. 4. The FF material 54 has inkejector chambers 64 formed therein which interconnect and establish flowcommunication of ink from the ink flow vias 58 of the heater chip die 48to the ink nozzle holes 60 of the nozzle plate 52, again the ejectorchambers 64 are not directly above the ink flow vias 58, but are locatedoutboard of them. Alternatively, the nozzle plate 52 and FF material 54could be an ablated film where the two are integrated into a monolithiclayer, in this case a polyimide. The heater elements 62 are arrayed nextto the ink flow vias 58 to provide thermal energy that causesvaporization of the ink into bubble-like drops of ink that aredischarged from ejection chambers 64 through the nozzle holes 60 ontothe print medium. The chip module 42 also has tab pads 66 on theperimeter of the front surface 48 a of the die 48 of the heater chip 44which are used to power the heater elements 62 by enabling a flow ofelectrical current through them. Each tab pad 66 on the heater chip 44is connected to an electrical lead 67 of a corresponding tab circuitconnection, tab trace, and electrical connection to the printing device.

From the foregoing description, it can be readily appreciated that asignificant difference of the chip module 42 of FIGS. 3 and 4 of thepresent invention from the prior art chip module 14 of FIGS. 1 and 2 isthe above-described basic three-component construction of the heaterchip 44 of the chip module 42, comprising the substrate 46 and at leastone die 48, both composed of silicon but of different wafers, and a bond50, non-adhesive and hermetic in nature, formed therebetween attachingthem together. The substrate 46 and die 48 are made in respectivecarrier and device wafers processed separately and then brought togethersuch that the die 48 is superimposed on the substrate 46 with respectiveselected back and front surface portions 46 a, 48 b on the substrate 46and die 48 disposed adjacent and facing one another. The hermeticnon-adhesive bond 50 between the respective carrier and device wafers atthe respective selected facing surface portions 46 a, 48 b on thesubstrate 46 and die 48 is formed by low temperature bonding technologywherein a composition, for example, a monolayer of an amine functionalgroup or a solution of 2% TMAH, is applied on at least one of therespective selected facing surface portions 46 a, 48 b which preparesthe carrier and device wafers at the respective facing surface portions46 a, 48 b of the substrate 46 and die 48 to bond to one another. Thesecompositions each provide a bond that is hermetic in nature, preventingany possibility of ink leakage or absorption of ink between the siliconlayers. The monolayer composition at low temperature, such as roomtemperature, forms a covalent bond 50 between the respective selectedsurface portions 46 a, 48 b, thereby transforming the respectiveselected surface portions 46 a, 48 b into one substantially continuoushermetic structure, constituting a continuation of the Si—O latticebetween the silicon substrate 46 and the silicon die 48 equal instrength to a Si—O bond. The use of a solution of 2% TMAH at a roomtemperature low pressure process forms a hermetic polymerized siliconoxide bond in bonding silicon and silicon oxides substrates. The latterbonding technique, characterized as low thermal fusion bonding, isdisclosed in the pending patent application Ser. No. 11/848,246cross-referenced above, the disclosure of which is incorporated hereinby reference.

The above-described heater chip 44 of the chip module 42 is fabricatedin accordance with the method of the present invention which isillustrated in general terms in the flow diagram of FIG. 5. Initially,in PROCESSING steps, as represented by separate boxes 68, 70, blankcarrier and device wafers, composed of silicon, are processedseparately. The blank carrier wafer after processing contains an arrayof substrates composed of silicon and of a predetermined thicknesstailored to resist bowing. The blank device wafer after processingcontains an array of electrical chips or dies composed of silicon and ofa predetermined thickness relative to that of the substrates andtailored for the particular application. The carrier wafer also containsalignment elements, fiducials or reference points, which are used at asubsequent ALIGNING step. Next, in a PREPARING step, as represented bybox 72, selected surface portions of at least one of the processedcarrier and device wafers is prepared, such as coated, with acomposition that enables them to bond together at a subsequent BONDINGstep. Following next, in an ALIGNING step, as represented by box 74, theprocessed carrier and device wafers are brought into alignment with oneanother such that the array of dies of the processed device waferoverlies and aligns with the array of substrates of the processedcarrier wafer and also such that the prepared surface portions on theprocessed device wafer, for example, overlie and align with the surfaceportions on the processed carrier wafer in a facing relationship.Following next, in a BONDING step, as represented by box 76, the alignedand processed device and carrier wafers are brought together where byemploying low temperature bonding technology they non-adhesively andhermetically bond to one another at the respective aligned and facingsurface portions.

The intended construction of the chip module, that is, whether it willbe a single die attached on each substrate or plural dies attached oneach substrate, determines where a dicing of the bonded processedcarrier and device wafers takes place. For instance, the dicing followsthe BONDING step when it is intended that the chip module have a singledie on each substrate. Alternatively, dicing of the processed devicewafer takes place earlier, before the PREPARING, ALIGNING and BONDINGsteps, where the objective is to obtain plural dies to attach to eachsubstrate on the carrier wafer. Then, after the PREPARING, ALIGNING andBONDING steps are performed resulting in the attachment of the desiredplural dies to individual substrates on the carrier wafer, dicing of theindividual substrates laden with the plural dies takes place.

Due to separate processing of the carrier wafer from the device waferunder this method, by using substrates with increased thickness toresist bowing thereof, the necessity to utilize an adhesive die bondattachment of the heater chip of the chip module to a plastic base plateof an ink bottle, if such be desired, to complete assembling of theprinthead chip module, is avoided.

More particularly, in the PROCESSING of the blank carrier wafer, as perbox 68, initially a surface of a thermal oxide layer on the singlecarrier wafer is planarized and polished, and then patterned with viasand alignment fiducials (reference points) in streets. One or several(single or multi-via product) fluid supply vias would be formed in thepatterned thermal oxide carrier wafer by a variety of existing means:grit blast, water jet, laser, DRIE, or wet etch: whichever is deemedmost appropriate to create the desired supply via geometries. The viapattern in the planarized thermal oxide silicon substrate would matchthe product this carrier wafer was fabricated for, and the alignmentfiducials would serve a subsequent aligning step. The thickness of thecarrier wafer of the predetermined size would have been preselected suchthat each substrate in the array on the carrier wafer has a thicknessranging from no less than the thickness of the prior art substrate to apredetermined greater thickness that will benefit chip planarity byresisting bowing. Alternatively, each of the substrates in the array onthe carrier wafer could be comprised of more than one polished blankwafer sandwiched and bonded together using a suitable low temperaturebonding technique.

In the PROCESSING of the device wafer, as per block 70, the electricalcircuitry is conventionally provided at the front side of this wafer. Abackside or back surface of this wafer is etched with vias, fluid flowfeatures and a nozzle plate using processes that are known in the art.Backside polishing is required rather than back grind due to thesubstantially increased flatness that chemically polished wafers offer.

After the PROCESSING of the carrier and device wafers are completed,then next, in the PREPARING step, as per box 72, selected surfaceportions of at least one of the now processed carrier and device wafersis prepared, such as coated, with a composition that enables them tobond together at the subsequent BONDING step. One of ordinary skill inthe art will recognize that the PREPARING step may include anypre-processing steps that may be required for the chosen low temperaturebonding technology. In one embodiment, for example, the silicon and thepolished back side of the processed device wafer are coated with theamine functional group or the solution of 2% TMAH. After PREPARING thesurface portions, next, in the ALIGNING step, as per box 74, theprocessed carrier and device wafers are brought into alignment with oneanother. In particular, the device wafer would be aligned to the carrierwafer using any suitable technique, such as by using infra red cameras.Following next, in the BONDING step, as represented by box 76, thealigned and processed carrier and device wafers are non-adhesively andhermetically bonded to one another at the respective aligned and facingsurface portions. Specifically, the device wafer is placed on thecarrier wafer where it is bonded. As mentioned above, the intendedconstruction of the chip module, that is, whether it will be a singledie attached on each substrate or plural dies attached on eachsubstrate, determines where in the method the dicing of the bondedprocessed carrier and device wafers takes place.

The heater chip 44 of the present invention and method of the presentinvention for fabricating the heater chip 44, as just described, providea solution to the problems associated with the prior art in that thenon-adhesive and hermetic bond 50 formed between the substrate 46 anddie 48 cures at room temperature avoiding the repetitive expansion andcontraction cycling during cooling as in the case of the prior artadhesive die bond (of the heater chip 20 to the bottle base plate 12)which is a major contributor to poor chip planarity. The bond 50 betweenthe substrate 46 and die 48 is essentially a continuation of a Si—Olattice and thus, in effect, constitutes a hermetic seal so ink will notleak nor be absorbed between the silicon layers. The substrate 46 has agreater thickness to resist bowing and a potentially large surface areafor better die bond adhesion and sealing, if it is still desired to usean adhesive attachment technique to the ink bottle. The use of thesubstrate 46 with the increased thickness also negates the detrimentaleffects of die bond and encapsulant induced chip bow and therebyimproves substantially the planarity of polymer nozzle plate surface.Further, there is a stress-free bonding since there is bonding ofsimilar materials to one another, a die 48 to a substrate 46 with a Si—Olayer. Since the die 48 is placed directly on the front surface 46 a ofthe substrate 46, that can easily be planarized to nanometer flatness byvarious means of polishing of a thermal oxide layer, the flatness of theprinthead chip module 42 will mirror the extreme flatness of thesubstrate 46. Finally, an improved heat sink is provided by the increasein the mass of silicon in the substrate 46, thereby overcoming the priorart difficulty of heat transfer to occur through the thick insulativematerial of an adhesive die bond, for example, of approximately 100 μm.

Turning now to FIGS. 6-13A, there is illustrated other or furtheraspects of the present invention relating mainly to different designrefinements, tradeoffs and tailoring-type modifications and enhancementsthat can be made to the components of the chip module 42 in order toattain cost reductions by reductions of their relative sizes whileimproving manufacturability of operations features and attributes of thecomponents without sacrificing the print quality and speed thereof.Reducing the cost of the printhead chip module 42 in an inkjet printeris of paramount importance. A very useful tool in decreasing the chipmodule cost is to decrease the size of the nozzle plate 52 and the sizeof the silicon die 48 of the heater chip 44, thereby decreasing itscosts. The cost is reduced with decreased size because more dies areyielded from a given wafer. Some mask steps may have to be added inorder to decrease the die size, which will offset the cost savings tosome degree. Still, the industry cost reduction trend is to decrease thedie size so that more dies are yielded from a given wafer. The silicondie of the heater chip with nozzle plate is the major factor indetermining the cost of the chip module, so any reduction in its costsaffects the overall printhead cost significantly. But, reducing the sizeof the silicon die of the heater chip with nozzle plate is constrainedbecause it is also the major factor in determining the quality and speedof printing. So, simply reducing the die length would impact performancerequirements. Therefore, to reduce the size of the die and nozzle plate,the width must be decreased while the length should be tailored to thecost/performance requirements of a particular printing application.Also, the construction quality of the die and nozzle plate determinesprint quality. Therefore, the width must be decreased in a manner thatallows precise construction so that print quality is maintained orimproved. The design that facilitates shrinking the width of the diemust consider how to feed a given ink flow rate into a smaller space.The design should also consider how to scale up to larger print swathsby providing a means to connect several individual dies togetherprecisely on a common substrate. This common substrate must becompatible with silicon both in assembly temperatures and in thermalexpansion while in use. Therefore, what is needed in the inkjet industryis a low-cost and precise method that provides ink flow into one or moreminiaturized dies of heater chips.

The direct bonding of a silicon die of the heater chip to a siliconsubstrate as carried out by the present invention provides a low-costand precise way of providing an ink feed into one or more miniaturizedheater chips. The silicon substrate is low-cost because it does notrequire any electrical function. The carrier wafer will have wet or dryetching processes performed to construct the ink supply channels orvias. The silicon device wafer is direct bonded to the silicon carrierwafer, providing a hermetic seal that does not require adhesives.Without adhesives, the placement of the device wafer onto the carrierwafer will be more accurate and therefore smaller features can beformed. Further, it is possible to precisely attach the device waferonto the carrier wafer such that more than one die is attached to agiven substrate to increase either the print swath or the number ofprint colors to increase performance. Also, the silicon substrate is aperfect thermal expansion match to the silicon die(s) and provides for athermal heat sink.

Turning first to FIGS. 6 and 7, there is illustrated two embodiments(not drawn to scale) of how tailoring the components making up the chipmodule 42 can be implemented, allowing flexibility that is dependent onmanufacturing capability. These two embodiments are really alternativeembodiments of the present invention in that the relative thicknesses ofa silicon substrate 46 and silicon die 48 are modified and portions ofthe ink supply and flow vias 56, 58 through them are modified. In theone embodiment of FIG. 6, the thickness of the silicon die 48 (forexample, about 150 μm) is more (for example, about 1.5 times greater)than that (for example, about 100 μm) of the substrate 46 (the fluidicmanifold). The die 48 has formed therein from its back surface 48 b aplurality of lateral ink feed portions 58 a (for example, about 75 μmtimes 125 μm, 120 nozzles) of the ink flow vias 58, each having asubstantially rectangular configuration.

In the other embodiment of FIG. 7, the thickness of the fluidicmanifold, the silicon substrate 46, (for example, about 225 μm) is more(about 9 times greater) than that of the die 48. Formation of forwardand lateral feed (or flow) portions 56 a, 56 b of the ink supply vias 56is only in the substrate 46, where they have respective flared or funneland rectangular configurations.

In both embodiments FIGS. 6 and 7 and as shown in greater detail earlierin the enlarged fragment of FIG. 4, the substrate 46 has formed thereinextending from its back surface 46 b a plurality of forward feedportions 56 a (for example, about every 1/10th of an inch apart for 1200DPI) of the ink supply vias 56, each with a flared or funnelconfiguration. In FIG. 7, these forward portions 56 a extend to thefront surface 46 a of the substrate 46 where they merge into the lateralfeed portions 58 a at the back surface 48 b of the die 48. In FIG. 7,they merge with the lateral feed portions 56 b within the substrate 46.Also, as seen in FIGS. 4 and 7, between each pair of nozzle holes 60,the ink flow via(s) 58 of greatly reduced diameter (for example, about10 μm times 10 μm, times 25 μm long) extend through the die 48 of theheater chip 44 so as to link and communicate the ink supply vias 56 ofthe substrate 46 with each of the ejection chambers 64, as best seen inFIG. 4, formed in the FF material 54 between the die 48 and the nozzleplate 52. Each ejection chamber 64 is aligned with and located behindthe pair of spaced apart nozzle holes 60 and extends laterally inopposite directions beyond the pair of holes 60. The nozzle plate 52 canbe made of polymer, silicon, MEMS, or other suitable organic orinorganic materials known in the art. The direct bond is formed by thebonding oxide layer 50 between the silicon substrate 46 and the silicondie 48 of the heater chip 44.

Thus, basically FIG. 6 shows the chip module 42 with the lateral inkfeed in the die 48, whereas FIG. 7 shows the chip module 42 with thelateral ink feed in the substrate 46. Both FIGS. 6 and 7 have a frontwafer, which is primarily the electrical device or die 48, and a backwafer, which is primarily the non-electrical substrate 46. Theattributes of the front wafer or die 48, although not so limited,include the following: (1) contains the majority of the electricalfunction (heater elements, FET, logic, Power, etc.); (2) relativelyexpensive per unit area due to number of mask steps; (3) would need tobe relatively small to optimize yield per wafer (perhaps 0.5″ swath with2 mm width); (4) forward ink feed per chamber formed with DRIE or someother precision process; (5) very thin (on the order of 30 to 50 μm inthickness) to aid in fluid flow; (6) PINP or other MEMS based nozzleplate 52 on the FF material 54 (only seen in FIG. 4) above the die 48;and (7) several configurations of small DRIE ink vias possible, as seenin FIGS. 8A-8C.

The attributes of the back wafer or substrate 46, although not solimited, include the following: (1) only electrical function is optionalfan-out wiring from front piece metal vias to wirebond or tab circuitpads; (2) relatively inexpensive per unit area due to minimum number ofmask steps; (3) could be long enough for a page-wide printhead, a 200 mmwafer would yield on the order of 50 dies of 8.5″ swath; (4) big inkfeeds formed from grit blast or other low cost bulk method such as wetor dry etch; and (5) normal thickness, i.e. 300-750 μm or thicker foradditional strength during attachment to bottle.

The attributes of the substrate 46 and die(s) 48 together insofar asthey permit or promote integration, although not so limited, include thefollowing: (1) direct bonding to attach one or more die(s) 48 to thesubstrate 46, a semi fab compatible process with hermetic seal and theZiptronix direct bond technique being one example of a bonding processthat can be utilized; (2) plural dies can be joined together end-to-endwith no overlap so that width of the substrate is the same as that ofthe dies; (3) electrical vias line up top to bottom; (4) forward inkfeeds in dies line up with appropriate bulk ink feeds in the substrate;(5) die would be standard building block of optimum swath; multiple diescould be mounted on one substrate to achieve a desired swath; and (6)substrate length would be in increments of the die, typical lengthsbeing, for example, one inch for scanning head, four inches for photo,and 8.5 inches for page wide.

For a better understanding of how components making up a chip module canbe added to, enhanced and/or modified in accordance with the principlesof the present invention to meet cost reduction goals withoutsacrificing, but rather improving, performance, in the followingdiscussion reference will be made to the details of the chip module 42,as shown in FIG. 4. In the diagrammatically illustrated (not to scale)Chip module 42 of FIG. 4, the basic three-component approach of thepresent invention still applies: the substrate 46 and the die 48, bothmade of silicon but of separate wafers, are attached togethernon-adhesively at the bond 50 in FIG. 4. The method of bonding can beone currently available in MEMS technology. The die 48 is the main partof the module 42 and is comparable to the current die of FIG. 2 but muchsmaller in width since the ink flow vias 58 of the die 48 can be madewith a width possibly ten times smaller using the DRIE process. The tentimes smaller width is calculated with a conservative DRIE aspect ratioof 20:1. With current thickness of 450 μm, it is possible to etch an inkvia (or small holes) having a width as thin as 25 μm. In contrastthereto, as seen in FIG. 2 the current ink via width dimension is 250 μmfor color. Thus, this smaller DRIE ink via width of 25 μm provides asaving in width of almost a millimeter on every die. Additionally, thedie 48 will be smaller in thickness, compared to current dies, tominimize the distance the ink must travel through the small orifice. Theink supply via 56 in the substrate 46 allows the ink flow from thechannels 35 in the base plate 12 of the bottle 18 to the die DRIE via 58to be unrestricted by incorporating a funneling effect, as also seen inFIGS. 6 and 7. This funnel 56 a in the via 56 is achieved by employingtwo wafers 82, 84 to make up the substrate 46 and then by wet etching ofthe upper one of the two wafers 82 using standard etching processes. Thedie 48 can be bonded at bond layer 50 to the upper wafer 82 of thesubstrate 46 by using MEMS wafer bonding technique as described below.The substrate upper wafer 82 can be bonded to the substrate lower wafer84 or to still another substrate wafer depending on the overall designof the printhead chip module 42.

Next, FIGS. 8A-8C illustrate diagrammatically possible DRIE viacross-sectional configurations in the chip module 42 of FIG. 4. All viasare on the order of 10-25 μm in horizontal width as seen in the view. InFIG. 8A, the DRIE vias 58 are individually of circular configurationsand one via feeds several heater elements 62. In FIG. 8B, the DRIE vias58 are of interrupted oblong configurations and, again, one via feedsseveral heater elements 62. In FIG. 8C, the DRIE via 58 is a continuousoblong configuration and one via feeds the entire array of heaterelements 62.

Wafer bonding in MEMS is a common practice and can be done in severaldifferent manners. Satisfactory ways to bond the silicon nozzle plate 52to the silicon based flow features 54 are: (1) low temperature bonding;and (2) fusion bonding.

One of the several known techniques of low temperature bonding is theZiptronix direct bonding technique, cited previously. It is performed atroom temperature without adhesives, and utilizes standard manufacturingequipment and Chemicals typically found in today's merchant foundries.Once activated, Ziptronix wafers have an activation shelf life ofseveral hours, thereby facilitating high-volume, batch-drivenproduction. It is assumed that this process involves some form ofchemical-mechanical polishing (CMP) to planarize the substrates beforebonding

Fusion bonding is a process by which silicon to silicon bonds or siliconoxide to silicon oxide bonds can be made. The process is as follows: Thecarrier and device wafers are surface treated to insure cleanliness.(Surface treatment is dependent on material set.) Once cleanliness isinsured, the two wafers are brought together and aligned. This can beaccomplished through a silicon wafer by an IR camera and fiducial. Oncethe alignment, is carried out, the wafers are put together and apre-bond is made at room temperature using a slight pressure. Next thewafers are inspected for voids. If voids are present, the wafers arere-bonded by another pressure wave. After pre-bonding the bond strengthis such that the device can be handled in subsequent steps. Then thedevice is moved to a vacuum furnace for permanent bonding. In thefurnace, temperatures of approximately 120° C. are used. (See Berthold,Jakoby, Vellekoop: “Wafer-to-wafer fusion bonding of oxidized silicon tosilicon at low temperatures”, Elsevier, Sensors and Actuators A 68(1998) 410-413.) This is a commercial process that is known in the artand is already done on a manufacturing scale in MEMS fabs.

Referring now to FIGS. 9-14, as well as to FIGS. 8A-8C, for the inkjetprinthead chip module 42, some additional or modified steps of themethod of fabrication (shown in FIG. 5) according to the presentinvention are as follows: (1) as before, process a CMOS device wafer soas to provide it with DRIE ink vias (see FIGS. 8A-8C); (2) dice thedevice wafer into a plurality of dies in preparation for dies-to-carrierwafer bonding; (3) also process the carrier wafer so as to provide itwith wet etched (or other preparations, e.g. grit blast) ink via funnelmanifold; (4) surface treat the dies and carrier wafer for cleanliness;(5) align, either optically or with IR, the dies and carrier wafer aswell as wafer to wafer in case there are plural wafers to make up thesubstrate; (6) pre-bond and inspect for voids, then re-bond ifnecessary; and (7) for fusion bonding, grow permanent bonding thermaloxide in low thermal (T) furnace.

Other techniques exist that could be employed in the method of thepresent invention for bonding of silicon to silicon or silicon to oxide.These include: (1) eutectic gold to silicon bonding; and (2) diffusionbonding. It is also possible to deposit a thin layer of material (i.e.an oxide) through sputtering or chemical-vapor deposition (CVD)techniques that can then be used to form part of the substrate manifold.In this embodiment the thickness of the layer is limited to less than 20.mu.m. The advantage of oxide is that it can then be utilized to affecta bond to another piece of silicon to complete the manifold. It shouldbe understood that these techniques fall within the scope of the genericterm, low temperature bonding technology, which is employed by theinvention.

In accordance with the aforementioned additional enhanced and/ormodified steps of the method of fabrication according to the presentinvention, a variety of different chip module constructions can berealized. One exemplary embodiment, as seen in FIGS. 9 and 10, is a chipmodule 42 having a plurality of spaced apart multiple heater chips 44each comprised of a die 48 supported by and attached by a direct bond 50on a single silicon layer substrate 46. The single layer substrate 46 ofeach of the heater chips 44 is, in turn, supported by and attached on astack of multiple silicon layers 86 making up a manifold extension ofthe substrate 46 defining its ink flow system therein. Another exemplaryembodiment, as seen in FIGS. 11 and 12, is a page-wide chip module 42having a heater chip 44 comprised of a plurality of dies 48 arrangedend-to-end and supported by and attached by a direct bond 50 on a singlelayer substrate 46 which, in turn, is supported by and attached on astack of multiple silicon layers 86, as in FIG. 9.

Thus, in these other aspects of the present invention, two or moreheater chips 44 are aggregated to provide a chip module constructionhaving multiple chips disposed in spaced side-by-side relation as seenin FIG. 9, end-to-end relation as seen in FIG. 11, or staggered relationas seen in FIG. 14, and bonded on individual substrates 46, as seen inFIG. 9 or a common silicon substrate 46, as seen in FIGS. 11 and 14 withmany silicon layers 86 forming a manifold constituted by the many layersof silicon etched and joined together to make up an ink flow system. Theheater chip may be constructed of one piece or as above two pieces. Withthe heater chip 44 constructed of two pieces, the bottom substrate 46can be of page wide dimension with multiple top dies 48 direct bondedthereon. As seen in FIG. 13A, electrical metal vias 87 can be providedthrough the chip from a topside or front surface 49 to a bottom orbackside 51 of the heater chip 44 to allow electrical connection of chipto tab circuit 45 or other conductor on a front surface 47 of thesubstrate 46 in place of elevated exposed metal wires 88, as seen inFIGS. 9 and 11, which may affect distance of the nozzle to the page ofprint medium. The metal via 87 can be made by drilling a hole downthrough the active die (or device chip) 48 and filling it with metal toallow electrical connection of the device to the tab circuit.Alternatively, the process can include masking and etching to form ahole that is later filled by the metal via 87. Alternatively still, FIG.13B includes an electrical connection from a topside 49 of the die 48 toa metallization layer 55 (e.g., conductor) on the substrate 46 throughmetal via 87. As the metallization layer terminates on the substrate ata bond pad 53 well away from the vicinity of the die, a wire 88 canfreely connect to an external TAB, flex, PCB or other circuit 45′ at alaterally offset location. In this way, the wire can be fullyencapsulated and remain a relatively tall structure on the die/substratemodule without adversely interfering in maintenance of the nozzles ofthe nozzle plate 52, such as those that occur during wiping and cappingoperations. In one embodiment, it is expected that the bond pads 53 willreside at least 0.25 mm away from a periphery 89 of the heater chip 48,but more usually 1 mm or more. The wire 88 extends even further away.The wire also has a height 91 that is substantially taller than thecombined height of the die 48 and nozzle plate 52 on the substrate. Thisfeature also increases in importance as conventional heater chip widthsof 5 mm or more give way to modern designs approaching 2 mm or less.These modern chips may also optionally include ink flow vias 58 fluidlyinterconnected to ink supply vias 56 of the substrate 46 by way oflateral ink feeds 56′.

The advantages of these embodiments and aspects of the present inventionis hat they allow balancing of tradeoffs between chip size, performancerequirements, industry cost reduction trends and other factors so as toallow tailoring of heater chip and substrate parameters to achieve alow-cost and precise construction that provides a given ink flow rateinto the smaller spaces of one or more miniaturized heater chips.

The foregoing description of several embodiments of the invention hasbeen presented for purposes of illustration. It is not intended to beexhaustive or to limit the invention to the precise form disclosed, andobviously many modifications and variations are possible in light of theabove teaching. It is intended that the scope of the invention bedefined by the claims appended thereto.

The invention claimed is:
 1. A heater chip module for a micro-fluidejection head, comprising: a substrate defining a carrier having aplurality of fluid supply vias extending from a back surface to a frontsurface thereof; at least one die composed of silicon of a device waferseparate from said carrier, the die containing a plurality of fluid flowvias extending therethrough from a back surface to a front surfacethereof and also containing electrical circuitry including a pluralityof heater elements formed near said front surface, said heater elementsinterspersed with said fluid flow vias, said die being superimposed onsaid substrate such that said fluid flow vias of said die align withsaid fluid supply vias of said substrate and such that portions of saidback surface on said die and portions of said front surface on saidsubstrate align with one another and are disposed adjacent and facingone another; and a bond non-adhesively formed between the respectivefacing surface portions on the die and the substrate being hermetic innature and attaching the die and the substrate together.
 2. The heaterchip of claim 1 wherein said bond between said respective facing surfaceportions on said die and substrate is formed by low temperature bondingtechnology wherein a composition is coated on said facing surfaceportions of at least one of said die and substrate enabling theformation of said bond.
 3. The heater chip of claim 2 wherein saidcomposition is a monolayer of an amine functional group adapted to forma covalent bond transforming said silicon substrate and said silicon dieinto a substantially continuous structure at said respective facingsurface portions thereon.
 4. The heater chip of claim 1 wherein saidthickness of said die is greater than said thickness of said substrate.5. The heater chip of claim 1 wherein at least some of said fluid supplyvias of said substrate each contain a forward feed portion and a lateralfeed portion connected with one another and extending from said backsurface to said front surface of said substrate.
 6. The heater clip ofclaim 5 wherein said forward feed portion of said fluid supply via has afunnel-shaped configuration and said lateral feed portion has asubstantially rectangular configuration.
 7. The heater chip of claim 5wherein at least some of said fluid supply vias of said substrate eachcontains a forward feed portion extending from said back surface to saidfront surface of said substrate.
 8. The heater chip of claim 7 whereinat least some of said fluid flow vias of said die each contain a lateralfeed portion connected with said forward feed portion of said fluidsupply via of said substrate at said back surface of said die.
 9. Theheater chip of claim 1 wherein said substrate is comprised of more thanone wafer bonded together.
 10. The heater chip of claim 1 wherein aplurality of said dies is bonded to said substrate.
 11. The heater chipof claim 10 wherein said dies are either spaced apart from one anotheron said substrate, or said dies are placed end-to-end with one anotheron said substrate.
 12. The heater chip of claim 10 wherein said bondbetween said respective facing surface portions on said die andsubstrate is formed by a low temperature bonding technology, whichcauses said bond to form substantially instantaneously upon said diemeeting said substrate.
 13. The heater chip of claim 10 wherein saiddies are placed in a staggered relationship to one another on saidsubstrate.
 14. The heater chip of claim 1, further comprising: aconductor on said front surface of the substrate, wherein a metal viaextends through said die to electrically connect the conductor and atleast one of the heater elements; and a bond pad on said front surfaceof the substrate electrically connected to the conductor on said frontsurface of the substrate, the bond pad for remotely locating anelectrical connection between the heater elements of the die to a remotecircuit and residing beyond a periphery of the die to avoid interferingin maintenance operations of a nozzle plate of the die.
 15. The heaterchip module of claim 14, wherein the metal via extends verticallythrough the die from the front surface of the die to the back surface ofthe die.
 16. The heater chip module of claim 14, wherein the conductoron said front surface of the substrate is a metallization layer on thesubstrate.
 17. The heater chip module of claim 14, wherein the bond padresides away from the periphery of the die in an amount at least asgreat as 0.25 mm.
 18. The heater chip module of claim 14, furtherincluding a wire electrically connected to the bond pad from the remotecircuit.
 19. The heater chip module of claim 18, wherein a height of thewire is taller than a height of the at least one die and the nozzleplate on the substrate.
 20. The heater chip module of claim 18, whereinthe wire is further away from said periphery of the die than is saidbond pad away from said periphery of said die.
 21. The heater chip ofclaim 15 wherein said composition is a solution of 2% TMAH adapted toform by a lower thermal fusion bonding technique a polymerized siliconoxide bond between said substrate and die at the respective facingsurfaces thereon.